The IRFZ44N N-Channel Power MOSFET Transistor D2PAK Package‚ IR MOSFET family of power MOSFETs utilizes proven silicon processes offering designers a wide portfolio of devices to support various applications such as DC motors‚ inverters‚ SMPS‚ lighting‚ load switches‚ and battery-powered applications. The devices are available in various surface-mount and through-hole packages with industry-standard footprints for ease of design.
RFP4321PbF Applications l Motion Control Applications l High Efficiency Synchronous Rectification in SMPS l Uninterruptible Power Supply l Hard Switched and High Frequency Circuits Benefits l Low RDSON Reduces Losses l Low Gate Charge Improves the Switching Performance www.DataSheet4U.com l Improved Diode Recovery Improves Switching & EMI Performance l 30V Gate Voltage Rating Improves Robustness l Fully Characterized Avalanche SOA HEXFET® Power MOSFET VDSS RDS(on) typ. max. ID D 150V 12m: 15.5m: 78A D G S G D S TO-247AC D S G Gate Drain Source Absolute Maximum Ratings Symbol ID @ TC = 25°C ID @ TC = 100°C IDM PD @TC = 25°C VGS EAS (Thermally limited) TJ TSTG Parameter Continuous Drain Current, VGS @ 10V Continuous Drain Current, VGS @ 10V Pulsed Drain Current d Maximum Power Dissipation Linear Derating Factor Gate-to-Source Voltage Single Pulse Avalanche Energy e Operating Junction and Storage Temperature Range Soldering Temperature, for 10 seconds (1.6mm from case) Mounting torque, 6-32 or M3 screw Max. 78 c 55 330 310 2.0 ±30 210 -55 to + 175 300 10lbxin (1.1Nxm) Typ. ––– 0.24 ––– Max. 0.49 ––– 40 Units A W W/°C V mJ °C Thermal Resistance Parameter RθJC RθCS RθJA Junction-to-Case g Case-to-Sink, Flat, Greased Surface Junction-to-Ambient g Units °C/W www.irf.com 1 6/23/06 IRFP4321PbF Static @ TJ = 25°C (unless otherwise specified) Symbol V(BR)DSS Parameter Drain-to-Source Breakdown Voltage Min. Typ. Max. Units 150 ––– ––– 3.0 ––– ––– ––– –.
Features:-
• Advanced process technology
• Low error voltage
• Fast switching speed
• Full-voltage operation
• High power and current handling capability
Each bridge in this IC includes two current sense pins like CSA & CSB and enable pins like ENA & ENB. Here, current sense pins are connected to the ground terminal but we can also include a low-value resistor where its voltage reading is relative to the current. Similarly, enable pins can also be used to make all the outputs active simultaneously
The pin configurations of L298 dual full-bridge driver IC include 15-pins where each pin is discussed below. This IC includes dual bridges namely; H-bridge A & H-bridge B.
Applications of HT12D Decoder IC:-